Contents of business
Surface Treatment Chemicals
- Pre-treatment
- ELF Process
- Electroless Copper Plating Process
- ENIG Process
- Electro Gold Plating Process etc.
RTR Facilities for each process
- Feed In
- Half Etching
- Leaser Drilling
- (NC Drilling)
- Plasma Treatment（Desmear, Dry Cleaning）
- Micro-Etching
- Conductive Treatment
- Copper Sulfate Plating
- DFR Laminating
- Exposure
- Developing・Etching・Stripping
- AOI
- Guide Hole Punching
- CL Punching
- CL Cleaning
- CL Pre-tacking
- CL Laminating
- CL-Additive Curing
- Micro-etching
- Electrolysis Ni/Au Plating
- Sheet Cutting
- Lead Cutting
- O/S Inspection
- Visual Inspection
- PSR Printing・Dry
- PSR Exposure
- PSR Development
- PSR Post-cure
Consulting
- Improve Yield
- Double Sided RTR Process
- In-house Manufacturing for 2-layer FCCL
- Manufacturing for Multi-layer FPC
- New and Renewal Facility Layout Design and Producing Machine and Chemicals
- Production control, Manufacturing control and QC System
- Market Research etc.
R&D
- RTR ENIG Machine (Under Development)
- RTR CL Auto Pre-tacking Machine (Under Development)
- RTR Stiffener Auto Pre-tacking Machine (Under Development)
- Ultra-thin Electrolytic Copper Foil
- Ultra-thin Cover Lay
- PE Type FPC
- Release Film etc.